• Charging pads and charging docks
• Wireless charging of medical devices
• Smart Wearables (watches, eyeglasses, earpieces)
• Smartphones and tablets
• Up to 60% reduction in cost vs Litz Wire
• Improved durability and ruggedness
• Thin profile
• Reduce BOM components
• AKS' Coil and ferrite shields validated by leading wireless chipset OEM's as a drop-in solution
Fujipoly's SPG-30B is a dispensable thermal interface material that is almost fully cured with a thermal conductivity of 3 watt/m-K.
It can absorb the mechanical tolerances of multiple hot components and dispensed with high volume pneumatic dispensing machines.
It is similar to Fujipoly's SPG-30A but at a major cost reduction and improved long term reliability.
GR-80A is a new thermal interface material from Fujipoly. It is a gap pad that maintains its thermal contact in applications where shock/vibration may be an issue. It is 13 watt/m-K and designed for high volume applications.
We'll be at SEMICON in San Francisco this week. Come by the Henkel booth and check out the latest adhesive technology going into semiconductors and equipment!
Hope to see you there!