Westech has worked on thermal applications for over 30 years and has partnered with industry leaders that are continually developing innovative thermal solutions.
Fujipoly offers a full range of thermal interface materials, including:
- Gap fillers - up to 17 watt/m-K
- Putties - soft, thin & high K
- Form-in-Place - absorbs mechanical tolerances, up to 8 watt/m-K
- Thin Films - good resistance to shear/penetration
- Custom Extrusions
- 3D Custom Molding
eGRAF® SPREADERSHIELD™ heat spreaders provide a unique material capable of moving heat away from a heat source while shielding sensitive electronics for users
SPREADERSHIELD™ heat spreaders are ideal for a wide range of electronics applications, from the thinnest and lightest smartphones to higher power devices.
HB Fuller is a $2 Billion global adhesives innovator, manufacturer and solutions provider to help customers imagine, create, design and produce both today's and tomorrow's electronics.
- Thermally conductive adhesives
- Board level materials
- UV curable materials
- Low temperature cure adhesives
- Structural bonding liquid adhesives
- Reactive hot melt adhesives
- Underfill and edge bonding materials
- Reactive film adhesives
- Materials dispensing equipment