Westech has worked on thermal applications for over 30 years and has partnered with industry leaders that are continually developing innovative thermal solutions.

Fujipoly offers  a full range of thermal interface materials, including:

  • Gap fillers - up to 17 watt/m-K

  • Putties - soft, thin & high K

  • Form-in-Place - absorbs mechanical tolerances, up to 8 watt/m-K

  • Thin Films - good resistance to shear/penetration

  • Custom Extrusions

  • 3D Custom Molding


eGRAF® SPREADERSHIELD™ flexible graphite heat spreaders provide a unique material capable of cooling a hot component, protecting a temperature sensitive component, reducing a thermal gradient, or preventing a surface hot spot.

  • In-plane conductivity 300-1600 W/mK

  • Anisotropic ratio up to 300:1

  • Thicknesses as low as 17μm

  • 30% lighter than Al and 80% than Cu

  • Continuous reel-to-reel format

  • Spreads heat up to 4x Copper and 7x Aluminum

  • Enables the slimmest device designs

  • Saves weight compared to metal alternatives

  • Ideal for high volume production

HB Fuller is a $2 Billion global adhesives innovator, manufacturer and solutions provider to help customers imagine, create, design and produce both today's and tomorrow's electronics.

  • Thermally conductive adhesives

  • Board level materials

  • UV curable materials

  • Low temperature cure adhesives

  • Structural bonding liquid adhesives

  • Reactive hot melt adhesives

  • Underfill and edge bonding materials

  • Reactive film adhesives

  • Materials dispensing equipment

Orion Fans - Knight Electronics

  • AC, DC, EC, Harsh Environment, High Static Pressure

  • Blowers, Impellers, Louvered Filtered Fan Kits

  • Quickest response

  • Largest available fan inventory

  • Shortest lead times

  • Competitive pricing