Westech has worked on thermal applications for over 30 years and has partnered with industry leaders that are continually developing innovative thermal solutions.


Fujipoly offers  a full range of thermal interface materials, including:

  • Gap fillers - up to 17 watt/m-K
  • Putties - soft, thin & high K
  • Form-in-Place - absorbs mechanical tolerances, up to 8 watt/m-K
  • Thin Films - good resistance to shear/penetration
  • Custom Extrusions
  • 3D Custom Molding

http://www.fujipoly.com/usa/current-catalog.html


eGRAF® SPREADERSHIELD™ heat spreaders provide a unique material capable of moving heat away from a heat source while shielding sensitive electronics for users

SPREADERSHIELD™ heat spreaders are ideal for a wide range of electronics applications, from the thinnest and lightest smartphones to higher power devices.


HB Fuller is a $2 Billion global adhesives innovator, manufacturer and solutions provider to help customers imagine, create, design and produce both today's and tomorrow's electronics.

  • Thermally conductive adhesives
  • Board level materials
  • UV curable materials
  • Low temperature cure adhesives
  • Structural bonding liquid adhesives
  • Reactive hot melt adhesives
  • Underfill and edge bonding materials
  • Reactive film adhesives
  • Materials dispensing equipment