waveSTRATE™ is a low loss high frequency non-reinforced laminate for microwave and mm wave applications. It is available in standard low loss (SMX-20286) and a thermally conductive low loss version (SMX-20285) waveSTRATE™ 26LB Copper Clad Laminates obtain enough characteristics according to filling ceramics into fluoro resin polymer. We propose it as a substrate material for high-frequency antennas and high-speed transmission. In addition it can be used like an FPC since has flexibility.
Fujipoly New Cutting Edge Thermal Interface Product Introduction
Westech Asscociates, Electronic Manufacturers Representative Northern California, is pleased to introduce a whole new line up of cutting edge best in class thermal interface products:
CF210A- 21 watt/mk carbon fiber thermal interface- https://www.dropbox.com/s/uy5owxwue8bifu2/CF210A_ES_DS8020_ver2.0.pdf?dl=0
PG130A- 13 watt/mk high performance putty thermal interface- https://www.dropbox.com/s/vde9fak04y1e9ea/SARCON_PG130A_ES_DS4170_ver2.0.pdf?dl=0
PG80B- 8 watt/mk soft high performance putty thermal interface- https://www.dropbox.com/s/hna873fl7nfj2r8/SARCON_PG80B_ES_DS4150_ver1.1.pdf?dl=0
SPG70A- 7 watt/mk dispensable one part thermal paste- https://www.dropbox.com/s/t4uoceoepnn2vlb/SARCON_SPG_ES_DS6010_ver5.1.pdf?dl=0
New Fujipoly World Class R and D Center
We are very excited to announce the opening of the new Fujipoly R and D Center in Nagoya Japan. With over 60,000 square feet if lab and office space, even better thermal interface solutions will be developed. Westech Associates is the manufacturers representative for Northern California and Northern Nevada.
Westech appointed Northern California Representative for Wakefield-Vette Heat Sinks
We are pleased to announce the appointment of Westech as the Northern California Representative for Wakefield-Vette heat sinks. With the addition of Wakefield we now have a complete package of thermal interface materials, graphite heat spreaders, thermally conductive adhesives, and phase change materials.
Mike Vega, Wakefield Sr. Applications Manager, has 25 years experience helping solve thermal challenges with innovative heat sink designs. We are certainly looking forward to working with Mike and learning from his wide ranging experience.
New Advanced Interconnect Mezza-pede SMT Connectors
Mezza-pede® SMT Connectors from
Advanced Interconnections are designed
for board-to-board or cable-to-board
applications where long-term reliability in a
high density package is required. The
newest addition, header model DHAL,
features an ultrathin molded insulator which
reduces z-axis stack height down to 3.4mm.
Engineered with an enclosed screwmachined
socket, 6-finger contact, and
heavy gold plating, precision molded
Mezza-pede® SMT Connectors meet the
stringent requirements of telecom and
other severe environment applications.
Mezza-pede® SMT Connectors can be
easily customized to application-specific
requirements.
We will be happy to drop off samples!